Taking our Laser Show on the Road at CPCA 2019

Taking our Laser Show on the Road at CPCA 2019

Planning on attending CPCA 2019 at the Shanghai New International Expo Centre? Stop by our ESI exhibit, which is located within the WKK booth 7R16.

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ESI Receives Significant Asia Order

ESI Receives Significant Asia Order

“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”

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Can you engineer innovation to learn faster than your competitors?

Can you engineer innovation to learn faster than your competitors?

How are innovators building strategic frameworks to choose lasers and analyze materials? What equipment are innovators using to process new materials to stay one step ahead? Do new end market demands require the rethinking of laser systems and architectures?

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Sights from HKPCA 2018

Sights from HKPCA 2018

ESI's photon playground is laser-focused on showcasing world-class via drilling solutions. The power of the photon is on full display at ESI's booth during the 2018 HKPCA show.

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Introducing Geode

Introducing Geode

[official press relese] The new Geode CO2 laser drilling system for HDI rigid printed circuit board manufacturing combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package

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Three Steps to Stay Ahead in Flex PCB Processing

Three Steps to Stay Ahead in Flex PCB Processing

Get insights into 3 methods to stay competitive in Flex PCB Processing. Learn how you can take advantage of high-speed UV Laser micromachining to stay ahead of your customers' evolving processing needs.

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ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...

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(Press Release) ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCs

(Press Release) ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCs

ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCsNew system from market leader addresses MLCC test demand for consumer and automotive markets PORTLAND, Ore., Oct. 01, 2018 (GLOBE NEWSWIRE)

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Challenge of small: Timekeeping devices

Challenge of small: Timekeeping devices

Challenge of small: Timekeeping devices ESI’s customers are continuously faced with the challenges of small in the creation of each new generation of electronic products.

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MLCC STAT!

MLCC STAT!

The current market for autonomous vehicles tugs at the same strings that drew crowds of viewers to the Knight Rider series. According to PwC, by the year 2030 – electronics will account for 50% of the total cost of a car. This means users will interact with cars more like they interact with their phones today. KITT is real.

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For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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