Beyond the Photon - Dr. Zhang provides insights into the current challenges and new opportunities in PCB manufacturing. You will get an understanding of the latest applications and materials emerging to deliver the future of communication - the 5G revolution.
“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”
How are innovators building strategic frameworks to choose lasers and analyze materials? What equipment are innovators using to process new materials to stay one step ahead? Do new end market demands require the rethinking of laser systems and architectures?
ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry
[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...
ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCsNew system from market leader addresses MLCC test demand for consumer and automotive markets PORTLAND, Ore., Oct. 01, 2018 (GLOBE NEWSWIRE)
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.