한국 및 기타 신흥 시장의 고객들은 ESI RedStone XP를 통해 PCB 용 레이저드릴 캐파를 지속적으로 확장하고 있습니다.
Learn the latest tips and tricks for developing effective flexible circuit laser processes.
[PRESS RELEASE] PORTLAND, Ore. – July 20, 2021 – MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced confirmation of an order for the ESI® Geode™ HDI via drilling system from TTM Technologies, Inc. (“TTM”), a major technology leader in the HDI PCB manufacturing market, for their facility in Guangzhou, China. The financial terms of the order were not disclosed.
Now it is time to get your new system installed and processing those first runs!
How do you get your your facilities ready for the introduction of laser processing?
When it comes to laser processing for flex PCB, how do you calculate and optimize total system cost of ownership (TCO) and cost per panel (CPP)?
Chapter 1: Laser technology for flex processing Manufacturing flow and considerations in adopting laserprocessing capabilitiesMarket demand for smaller, faster, wearable, lighter and more powerful
[PRESS RELEASE] “CapStone has definitely been a game changer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “As Flex PCB manufacturers continue to upgrade their processing capabilities to address new technologies such as 5G, the CapStone system is enabling them to take advantage of latest-generation laser technology to stay current in a very competitive market.”
Intra-pulse beam steering for High-Density-Interconnect via drilling by Jan Kleinert - Research Director at ESI, a Division of MKS Inc.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.