In the evolving landscape of laser drilling, the limitations of traditional hybrid systems are becoming increasingly apparent. This post examines the innovative Dual UV and CO2 laser system approach, which addresses these limitations and provides significant enhancements in speed, precision, and thermal management.
April 4th, 2025
Traditional hybrid laser drilling systems, while convenient, often fall short in terms of speed, precision, and thermal management. These systems combine a CO2 laser with a UV laser within a single system; however, this combination can compromise accuracy, via range capability, and overall throughput.
The Dual UV and CO2 laser system approach pairs a specialized UV laser with an advanced CO2 laser. This combination enables the processing of a broader range of base materials, resulting in improved processing quality and a smaller via capability. The result is a throughput that is 4.2 times faster than traditional hybrid systems.
For electronics manufacturers, this approach translates to higher production output and the flexibility to adapt to new and emerging applications. The dual system approach is designed to meet the demands of modern manufacturing and future-proof production capabilities.
To explore how this revolutionary approach can enhance your production line, download our comprehensive white paper for detailed insights. Get the white paper.
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