PCB Solutions Flexible-PCB | HDI
An extensive via drilling portfolio that includes the market-leading line of flex PCB laser processing systems and CO2-laser-based solutions for accurate and affordable HDI PCB manufacturing and substrate processing.
Semiconductor Solutions Groove | Dice | Mark
Wafer processing and memory repair solutions that apply optimized laser technology to maintain high-volume production without sacrificing yield...even when processing thin wafers or incorporating new materials.
Industrial Machining For A Range of Materials
Cut, drill, weld and engrave on glass, leather, ceramic or metal. Laser micromachining systems enable powerful laser processing.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.