Precision, Accuracy & Speed to Optimize Production

ESI delivers market-leading solutions for Flexible PCB laser processing, HDI PCB laser processing and high-speed MLCC testing. Our solutions help manufacturers optimize production of the materials, components and systems integral to modern electronic devices.

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High-performance breakthrough productivity for flex PCB UV drilling

See Precision and Speed in Action.

Take the Capstone 3D Tour
CapStone™ High Speed Flex-PCB Laser via Drilling System
Geode™ CO2 Via Drilling System For FCBGA (ABF) IC Substrates

High-precision, high throughput CO2 via drilling for HDI PCB manufacturing and IC packaging

See Precision and Speed in Action.

Take the Geode 3D Tour