Laser Via Drilling Flex-PCB, HDI, Packaging
A via drilling portfolio that includes the most popular line of flex PCB processing systems, a CO2-laser-based system for affordable HDI PCB manufacturing and high-volume low cost-of-ownership solutions for IC packaging.
Wafer Processing Grooving, Dicing, Marking
Wafer processing and memory repair solutions that apply optimized laser technology to maintain high-volume production without sacrificing yield. Even when processing thin wafers or incorporating new materials.
Laser Ablation and Micro Machining
Cut, drill, weld and engrave on glass, leather, ceramic or metal. Or discover the composition of materials. Laser micromachining and laser ablation systems enable powerful laser processing.
The world is transforming. ESI is focused on delivering new and innovative micro-manufacturing solutions that empower our customers to build the products that transform lives.
The development of this new technique provides our customers the ability to generate data across the periodic table at detection limits superior to traditional methods in a very cost effective manner.Jon Landau, Vice President of the Geoanalytical Division, Bureau Veritas Minerals
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.