With increased device complexity driving advanced PCB and packaging in everything from mobile devices to the supercomputing power required to drive artificial intelligence. MKS has been working with our partners to combine the adjacent expertise of Atotech process chemistry with ESI via drilling to offer the innovative, unique industry solution to accelerate your Southeast Asia road maps.
July 16, 2024
Introducing Optimize the InterconnectSM, an MKS solution that provides printed circuit board (PCB) and advanced electronics packaging customers with a wide range of products and services for the interconnect creation of the most advanced PCB and IC packaging designs. Services include PCB and advanced electronics packaging interconnect creation and evaluation services, access to the MKS Technology Centers for installation, set-up and troubleshooting services, application development services, application labs and support, design and development services, and maintenance, repair, and calibration services.
This unique combination of MKS' expertise in via drilling and routing and chemical electroplating provides opportunities for customers to accelerate their product roadmaps and solve the challenges associated with new materials and finer feature sizes, thereby creating the interconnection more effectively with higher quality output and faster time to market.
New Optimize the Interconnect innovations are driving new technology within markets from consumer electronics to the emerging Low Earth Orbit market. Including new facilities in Vietnam and throughout Southeast Asia. To learn more about our combined synergies and learn how the BondFilm LDD chemistry and Geode™ PCB laser drill are delivering the next frontier of PCB Manufacturing visit Optimize the interconnect - Atotech.
Together in Southeast Asia, let's Optimize the Interconnect.
If you have questions on Southeast Asia PCB expansion or the solutions MKS provides for the PCB manufacturing market, please email us. esi.info@mksinst.com
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