Data Sheets

The Geode A laser drill combines special laser/optics configuration with precision pulse shaping and steering specifically designed for ABF materials. Geode’s technology enables a greener manufacturing solution through 21% less floor space 72% less weight and up to 65% less power consumption than the competition.

CapStone provides a laser-based FPC processing solution that utilizes a new generation of laser technology and laser control capabilities to simultaneously deliver high-quality, high-speed via drilling.

RollMaster™ extracts maximum performance out of your ESI flexible circuit laser drilling tools. Blaze through material using ESI Model 5335’s maximum 1.5g stage acceleration with the RollMaster’s proprietary lightweight dancer design and control. Reduce your cycle time with RollMaster’s high-speed web indexing.

The 5335™ is a good fit for FPC and rigid-flex manufacturers that require high-productivity, high-quality, highaccuracy laser processing. Field-proven at the world’s top 10 flex manufacturers, the 5335 is equally capable of processing large and small features ranging from blind vias, through vias, routs, and depth-limited patterns.

Allegro XP delivers the levels of precision demanded by leading MLCC manufacturers producing larger and higher-voltage chips for applications in industries such as automotive, IoT, handheld devices and commercial communication equipment.

The Geode™ laser drilling system combines a powerful CO2 laser with a set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.

The RedStone™ system delivers an optimized FPC manufacturing solution, pairing the appropriate laser and laser control capabilities to efficiently address applications that require more powerful processing capability or more repetitions and a lower cost-of-ownership.

Allegro performs high-throughput production-level electrical testing of multi-layer ceramic capacitors (MLCC) at productivity rates of up to 20,000 chips per minute (1.2M chips per hour), with exceptionally low cost of ownership.

Increase via drilling operational performance with CapStone’s SPOT ONTM feature upgrade: Higher Yield by reducing common via quality issues, Reduced impact of fleet and lot variability, Automated laser-to-camera focus offset

The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology.

The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.