5335™ Flex PCB Laser via Drilling System
5335™ Flex PCB Laser via Drilling System
Best-in-class high-volume FPC laser drilling machine for flexible PCB Manufacturing.
Features
Industry-Standard Blind and Through via Production
The 5335™ is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. The 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.
High-power diode-pumped UV laser for high productivity
The 5335 incorporates a high power diode-pumped laser to enable efficient cutting through copper-clad laminates and lower your processing cost per panel with high productivity.
Third Dynamics™ Technology
Utilizing ESI’s Third Dynamics™ technology, the 5335 delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards. It also addresses other high-accuracy laser processing applications such as routing, patterning, and skiving through a combination of ESI's patented compound beam positioning and solid-state optical technology.
Precision Pulse™ Power Control
Reduce your yield loss even for challenging depth-limited processes using ESI’s industryleading Precision Pulse™ power control. This feature continuously measures and adjusts the energy of every laser pulse that touches your material to ensure robust process quality every time.
Low Cost of Ownership
The Model 5335’s low cost of ownership—along with its high-volume laser manufacturing focus—optimizes your laser processing and production capabilities and puts you in a better position to keep up with the increasingly demanding needs of industries such as consumer electronics, automotive and medical devices.
A range of systems for a range of challenges
- Precision Pulse™ digital power control
- Automated vision system for alignment and scaling compensation
- Easy-to-use Windows 10 interface
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
Processes
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Patterning
- Skiving
- Coverlay routing
Materials
- Polyimide (PI)
- Liquid Crystal Polymer (LCP)
- Copper-clad Polyimide Laminates (CCL)
- Adhesiveless
- With Adhesive
- Glass-reinforced laminates (FR4, BT, RT Duroid)
- Coverlay (Polyimide plus Adhesive)
Resources
Application Notes
Flex PCB Processing Process Development Tips and Tricks for Effective Flexible Circuit Laser Processes How to Get Your New Flex System Installed and Processing Those First Runs Getting Your Facilities Ready for the Introduction of Laser Processing How to Calculate and Optimize Total System Cost of Ownership and Cost per Panel Manufacturing Flow and Considerations in Adopting Laser Processing Capabilities
Data Sheets
5335 Data Sheet(460 kB, PDF)
Literature
Flex Circuit Laser Processing eBook(4.5 MB, PDF) ESI Laser Drill Systems(5.8 MB, PDF)
White Papers
Stepping Up to Laser Processing for Flex PCB(807.5 kB, PDF) Keeping Current to Stay Competitive in Flex PCB Processing(1.4 MB, PDF)
