Higher productivity and higher yields for lower cost of ownership.
Features
Reduce your yield loss even for challenging depth-limited processes using ESI’s industry-leading Precision Pulse™ power control
The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology. With the added assurance of energy traceability and closed-loop power control that Precision Pulse™ provides, RedStone XP is a low-risk investment.
Enhanced Productivity
With RedStone’s high frequency laser technology and the 5335’s real-time power control capability, RedStone XP achieves high productivity at low cost for a larger range of applications.
Precision Pulse™ Power Control
Reduce your yield loss even for challenging depth-limited processes using ESI’s industryleading Precision Pulse™ power control. This feature continuously measures and adjusts the energy of every laser pulse that touches your material to ensure robust process quality every time.
Trusted Yields, Trusted Partner
RedStone XP applies ESI’s decades of laser-material interaction expertise to provide higher performance. This enables FPC manufacturers to drill high-density designs with an increased yield— while limiting incidental damage.
Confident processing of high-quality vias, with the best UV nsec routing on market
- ESI-patented compound beam positioning technology
- Automated vision system for alignment and scaling compensation
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
Processes
- Through via drilling (THV)
- Flex and interconnect processing
- Blind via drilling (BHV)
- Routing
- Coverlay routing
Materials
- Polyimide (PI)
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (FR4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
Resources
Application Notes
Flex PCB Processing Process Development Tips and Tricks for Effective Flexible Circuit Laser Processes How to Get Your New Flex System Installed and Processing Those First Runs Getting Your Facilities Ready for the Introduction of Laser Processing How to Calculate and Optimize Total System Cost of Ownership and Cost per Panel Manufacturing Flow and Considerations in Adopting Laser Processing Capabilities
Literature
Flex Circuit Laser Processing eBook(4.5 MB, PDF) ESI Laser Drill Systems(5.8 MB, PDF)
Data Sheets
Redstone XP Data Sheet(408.8 kB, PDF)
White Papers
Stepping Up to Laser Processing for Flex PCB(807.5 kB, PDF) Keeping Current to Stay Competitive in Flex PCB Processing(1.4 MB, PDF)
