Features

Easily address most flex and rigid-flex PCB processing needs

RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

Accuracy

Don’t sacrifice accuracy to meet your cost of ownership targets. The RedStone system benefits from the same accurate frame, precision engineering, and alignment and scaling mechanisms at ESI’s top-tier flex drilling systems.

Depaneling

RedStone utilizes a highrepetition-rate / high-averagepower laser that is well suited to applications such as through hole drilling and through cutting. The laser minimizes heat affected zones to deliver higher quality cutting with minimal risk of degradation to the material.

High Uptime

Rest assured that your RedStone system will stay productive with high uptime. RedStone shares over 90% of components in common with the flagship ESI Model 5335™ in high-volume 24/7 production at the world’s top 10 flex circuit manufacturers.

Ideal for Large Process Window Applications

RedStone is the ideal system for processing applications that can be developed with large process windows. Large process window applications examples include through-cut routing, through via applications, larger blind vias on robust flex materials and removing easily-ablated materials from a durable substrate. Applications such as these can best utilize RedStone’s high accuracy, high throughput capabilities while ensuring high process yield.

Engineered for production-oriented flex PCB laser processing

  • ESI-patented compound beam positioning technology
  • Automated vision system for alignment and scaling compensation
  • Easy-to-use Windows 10 interface
  • Multi-language operator user interface
  • Sophisticated process development functionality
  • Comprehensive logging and diagnostics functionality

Processes

  • Through via drilling (THV)
  • Flex and interconnect processing
  • Blind via drilling (BHV)
  • Routing
  • Coverlay routing

Materials

  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Copper-clad Polyimide Laminates (CCL)
    • Adhesiveless
    • With Adhesive
  • Glass-reinforced laminates (FR4, BT, RT Duroid)
  • Coverlay (Polyimide with Flexible Adhesive)

Specifications

  • Type
    Cross-axis brushless linear motor with digital galvanometer
  • Laser
    Nanosecond UV
  • Pulse Rate
    100-200 kHz
  • Laser Output Power
    20 W @ 100 kHz
  • Average Work Surface Power
    >14 W @ 100 kHz
  • Panel Size
    533 x 635 mm
  • Accuracy
    ±20 μm over entire panel area
  • Maximum Average Velocity
    500 mm/s
  • Peak Move Speed
    2,000 points per second
  • Controller
    ESI Custom DSP based controller
  • Interface
    Software, mechanical and electrical interfaces provide the capability to attach web and panel material handlers to the system.
  • Vacuum Chuck
    533 x 635 mm (±20 um accuracy)
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