Application Notes

As a leading provider of flex laser via drilling solutions, ESI applies decades of innovation and laser processing expertise to the challenges faced by customers focused on optimizing their production capabilities and lowering production costs.

High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale.

Millions of stents, heart valves, and components are tested in the medical industry each year with ESI's portfolio of market-leading metrology systems. Our systems go beyond dimensional inspection to include defect detection for a wide range of critical and cosmetic defects.

Lasers are widely used in electronics packaging New end market demand requires rethinking of laser choices and system architectures. The system needs to provide high accuracy, high speed, and low cost Tertiary beam positioning technology enables high speed laser processing.

Dielectric materials where no copper cladding is required during lamination are typically used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applications.

Laser Direct Drilling is a process used for via formation (BVH & LTH) in a variety of dielectric materials, typically requiring some pre process preparation (thinned Cu, oxide treatment, etc.). The first LDD pulse (or burst) is critical in this via drilling process, as it typically defines the via opening size and roundness.

In the Comformal Mask Drilling process, the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.

SPOT ON™ increases performance by delivering a dynamic beam focus capability to high-production Flex PCB manufacturing. This capability enables beam location and control through automated z-mapping and dynamic z-control. With the SPOT ON™ feature, the CapStone™ system maps inconsistencies in height between the chuck, overlay, and panel. Once mapped, the system automatically adjusts the beam spot to deliver quality vias without waste.

Optimizing PCB laser processing for production requires a holistic view of the laser processes and their place in the production line. Taking the time to understand how those factors interact allows you to make informed decisions about where to focus your efforts and helps you to create a production process that effectively supports your organization’s unique set of operational goals.

With your systems in place and your operators and process engineers fully trained, your team is now equipped to start developing and running production processes. However, it is common for questions to arise as you start operating the tool. Don’t hesitate to stay in touch with your supplier. Especially for those new to laser processing, questions are normal.

With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might crop up. However, given that laser processing equipment and flex materials are both impacted by your facilities, your attention to and investment in clean, stable, and robust facilities and support equipment will quickly pay off in less downtime, higher yield, and — perhaps most importantly — fewer headaches!

When reviewing typical UV laser processing systems, upfront costs and maintenance costs make up the largest percentage of cost of ownership, with the majority of maintenance costs related to laser and optics replacement. As such, system and supplier longevity are especially important in order to depreciate these costs over the longest possible period.

There are several steps in the flexible circuit manufacturing process where laser processing can add value. This series will primarily focus on the laser micromachining processes related to drilling, coverlay cutting, and circuit singulation using general laser micromachining systems. Keep in mind that many of these same principles are also relevant in laser production of rigid boards and even to LDI.

For decades ESI has been a leader in offering automated test, high-speed handling and visual inspection equipment for the manufacture of MLCCs and other passive components, including arrays, inductors and varistors.