Application Notes

As a leading provider of flex laser via drilling solutions, ESI applies decades of innovation and laser processing expertise to the challenges faced by customers focused on optimizing ...

High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and ...

Millions of stents, heart valves, and components are tested in the medical industry each year with ESI's portfolio of market-leading metrology systems. Our systems go beyond dimensional ...

Dielectric materials where no copper cladding is required during lamination are typically used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applicat ...

Laser Direct Drilling is a process used for via formation (BVH & LTH) in a variety of dielectric materials, typically requiring some pre process preparation (thinned Cu, oxide treatment, ...

In the Comformal Mask Drilling process, the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.

SPOT ON™ increases performance by delivering a dynamic beam focus capability to high-production Flex PCB manufacturing. This capability enables beam location and control through automated ...

Optimizing PCB laser processing for production requires a holistic view of the laser processes and their place in the production line. Taking the time to understand how those factors ...

With your systems in place and your operators and process engineers fully trained, your team is now equipped to start developing and running production processes. However, it is common ...

With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might ...

When reviewing typical UV laser processing systems, upfront costs and maintenance costs make up the largest percentage of cost of ownership, with the majority of maintenance costs related ...

There are several steps in the flexible circuit manufacturing process where laser processing can add value. This series will primarily focus on the laser micromachining processes related ...

For decades ESI has been a leader in offering automated test, high-speed handling and visual inspection equipment for the manufacture of MLCCs and other passive components, including ...

Lasers are widely used in electronics packaging New end market demand requires rethinking of laser choices and system architectures. The system needs to provide high accuracy, high ...