Non-Copper Clad Dielectric Material Via Drilling

Dielectric materials where no copper cladding is required during lamination are typically used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applications.

Are you ready to elevate your non-clad processing?

effects of operating current level on the output spectrum of a laser diode
effects of operating current level on the output spectrum of a laser diode

Example Materials

  • ABF
  • Green sheet (LCC)
  • Ceramic (Si3N4)

Process Limitations

  • Non Cu-clad applications typically require low power, long pulse width laser profiles
  • There can be some throughput limitations (depending on applicable Geode configuration and via specs)
  • Material handling (limited protection)

Advantages

  • Low power
  • High throughput (depending on application)
  • More consistent via geometry (no glass fibers)
  • Low damage to bottom Cu