Market demand for smaller, faster, wearable, lighter and more powerful devices continues to keep PCB manufacturers scrambling to keep up as they evolve and adapt their manufacturing capabilities to meet changing customer needs. But keeping up with the dizzying pace of change in the world of PCB manufacturing need not be a daunting task. Employing laser technology is one of the best ways to stay current, as it enables printed circuit manufacturers to achieve manufacturing flexibility and agility with more accurate and/or smaller features than is possible with traditional processes.
Adding flexible circuit laser processing to your production capabilities can pay big dividends. It helps widen the scope of potential customers you can service and extends your reach into additional markets for which you otherwise wouldn’t have had a solution.
There are several steps in the flexible circuit manufacturing process where laser processing can add value. This series will primarily focus on the laser micromachining processes related to drilling, coverlay cutting, and circuit singulation using general laser micromachining systems. Keep in mind that many of these same principles are also relevant in laser production of rigid boards and even to LDI.
Printed circuit manufacturers typically invest in laser micromachining systems when punching, mechanical routing, or mechanical drilling becomes infeasible or is no longer cost effective due to one or more of the following issues:
If you’re facing some or all of these challenges, it’s time to consider a laser processing solution. But before launching into that endeavor, take the time to inform yourself about the right way to adopt laser processing capabilities. This application note will help you understand the implications while answering some important questions related to key topics:
Posts adapted from "Stepping Up To Laser Processing for Flex ebook authored by Patrick Riechel, Director of Product Marketing at MKS Instruments.