Flex PCB Laser Processing Systems

ESI's flex PCB laser processing systems excel in accuracy, power control, reliability and productivity. That helps our customers achieve higher quality production output with higher yields and lower overall cost of ownership. For applications ranging from simple coverlay cutting to advanced high-speed blind via drilling and circuit patterning processes, ESI’s flex systems are the solution of choice among the top PCB manufacturers worldwide.

capstone
Capstone
10K-W-BB-45
5335
10K-W-BB-45
Redstone
RedStone XP System
RedStone XP
10K-W-BB-45
LodeStone
Overview  Highest Throughput & via Quality  Flex Industry Standard Economincal System with Broad Capabilities  Economincal System with Broad Capabilities  Shortest Pulse Widths with High Reliability
Value Scale

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Positioning  Advanced Tertiary Positioning Tertiary Positioning Stage and Galvo Positioning Stage and Galvo Positioning Stage and Galvo Positioning
Maximum Average Velocity 10,000 mm/s 1,000 mm/s 500 mm/s 500 mm/s 500 mm/s
Peak Move Speed 14,000 points per second 2,000 points per second 2,000 points per second 2,000 points per second
Laser esiFlex™ ns UV ns UV Nd:YAG  ns UV  ns UV fs Green Fiber
Pulse Rate 300 kHz (for via) 40 to 90 kHz (for via)  100-200 kHz  100-300 kHz  Up to 1 MHz
Average Work Surface Power  11.4 W @ 300 kHz  6.6 W @ 40 kHz  14 W @ 100 kHz  7.8 W @ 1 MHz

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