This post explores the technical advantages of the Dual UV and CO2 laser system approach, highlighting its potential to significantly enhance manufacturing capabilities.
April 16th, 2025
The process begins with the UV laser ablating the top layer of copper without damaging the dielectric material underneath. For thicker copper layers, a pre-treatment is required. Once the dielectric layer is exposed, the CO2 laser removes the dielectric FR4 material.
Traditional hybrid systems integrate UV and CO2 lasers within a single system but often struggle with production speed, precision, and thermal management. The dual system approach, which utilizes separate UV and CO2 drills, provides faster and more accurate processing.
To understand how this technology can revolutionize your production process, download our white paper for an in-depth analysis of the Dual UV and CO2 laser system approach. Get the white paper.
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