Showing 12 products in 12 families
Products Here
Video

Intra-pulse Beam Steering for High Density Interconnect via Drilling

Discover how innovations in laser performance, and high bandwidth beam positioning combined with the ability to do high-level laser material interaction modeling, has enabled the development …

Application Note

Laser Based Micro Fabrication Systems for Electronics Packaging

Lasers are widely used in electronics packaging New end market demand requires rethinking of laser choices and system architectures. The system needs to provide high accuracy, high …

Data Sheet

 

The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. …

Application Note

Discover the SPOT ON™ Advantage

SPOT ON™ increases performance by delivering a dynamic beam focus capability to high-production Flex PCB manufacturing. This capability enables beam location and control through automated …

Video

High-Volume MLCC Testing with Allegro

Learn how Allegro tests high volumes of multi-layer ceramic components (MLCCs). Using ESI-pioneered technology, Allegro processes over one million MLCCs per hour.

Application Note

Rigid PCB Processing

High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and …

Data Sheet

 

CapStone provides a laser-based FPC processing solution that utilizes a new generation of laser technology and laser control capabilities to simultaneously deliver high-quality, high-speed …

Data Sheet

 

RollMaster™ extracts maximum performance out of your ESI flexible circuit laser drilling tools. Blaze through material using ESI Model 5335’s maximum 1.5g stage acceleration with the …

Data Sheet

 

The 5335™ is a good fit for FPC and rigid-flex manufacturers that require high-productivity, high-quality, highaccuracy laser processing. Field-proven at the world’s top 10 flex manufacturers, …

Data Sheet

 

Allegro XP delivers the levels of precision demanded by leading MLCC manufacturers producing larger and higher-voltage chips for applications in industries such as automotive, IoT, …

Literature

ESI Laser Drill Systems

ESI systems deliver market-leading solutions for Flexible PCB laser processing, high-speed MLCC testing, and CO2-laser-based systems HDI PCB and IC substrate manufacturing. ESI solutions …

Data Sheet

 

Allegro performs high-throughput production-level electrical testing of multi-layer ceramic capacitors (MLCC) at productivity rates of up to 20,000 chips per minute (1.2M chips per …

Data Sheet

 

Increase via drilling operational performance with CapStone’s SPOT ONTM feature upgrade: Higher Yield by reducing common via quality issues, Reduced impact of fleet and lot variability, …

White Paper

Preparing for Next-Generation Precision Laser Micromachining

ESI’s laser micromachining systems are the culmination of years of experience supplying laser processing systems that run 24 hours a day 7 days a week. These systems are optimized to …

Video

Inside Making a Via with Geode™: RTPC Edition

Discover how you can increase stability and via quality with the industry’s only real-time power control. Geode™ will enable you to actively manage power fluctuation to ensure higher …

Application Note

Getting Your Facilities Ready for the Introduction of Laser Processing

With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might …

Video

Geode A Footprint Benefits

The Geode™ A laser drilling system provides the most flexible processing and application solutions for the FCBGA package substrate market, components that provide critical building …

Application Note

MLCC Testing

For decades ESI has been a leader in offering automated test, high-speed handling and visual inspection equipment for the manufacture of MLCCs and other passive components, including …