High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership.
ESI leverages our expertise in laser processing and our proven track record of success in laser-based systems — especially in the flexible PCB manufacturing segment, where ESI is the clear market leader — and applies it to the HDI manufacturing segment. Our solutions are engineered to provide great reliability at high-quality output with the industry’s lowest cost of ownership, and backed by ESI’s professional service and support organization with local offices through the world.
HIGH DENSITY INTERCONNECT PLATFORMS
CO2 via drilling for HDI PCB manufacturing.
Take advantage of a powerful new CO2 laser and a new set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.
GeodeTM is ESI’s most advanced HDI microvia drilling solution for precision processing of a wide range of applications. Geode’s compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
- PCB Manufacturing
- Integrated circuit packaging
- Substrate processing
- System level packaging
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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