Innovating to Meet the Challenges of High-Volume Manufacturing
As market demands drive more complex customer requirements, you must innovate to stay ahead. Our CO2-Laser-based solutions for HDI rigid PCB manufacturing, IC packaging and substrate processing enable you to optimize production and lower your cost of ownership. Geode’s pairing of advanced beam control capabilities and high-speed laser technology enables you to deliver the efficiencies that will keep you ahead.
ESI’s Geode system enables PCB fabricators to incorporate into production a wider range of materials, from copper-clad base materials to glass-woven epoxy laminates and others.
High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing. These vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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