ESI RedStone XP Flex PCB Laser Processing System
The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology.
SUMMARY
Reduce your yield loss even for challenging depth-limited processes using ESI’s industry-leading Precision Pulse™ power control.
MARKETS:
- Flex PCB Laser Processing
- Rigid-Flex Laser Processing
- Laser Micromachining
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
APPLICATIONS:
- Through via drilling (THV)
- Flex and interconnect processing
- Blind via drilling (BHV)
- Routing
- Coverlay routing
SPECIFICATIONS
LASER:
- Type Nanosecond UV laser
- Pulse Rate 100-300 kHz
MATERIAL HANDLING:
- Vacuum chuck - 533mm x 635mm (±20um accuracy)
- Electrical and software interface for web and panel handler integration
FEATURES & OPTIONS
- ESI-patented compound beam positioning technology
- Automated vision system for alignment and scaling compensation
- Multi-language operator user interface
- Sophisticated process development functionality
- Comprehensive logging and diagnostics functionality
