Features

Reduce your yield loss even for challenging depth-limited processes using ESI’s industry-leading Precision Pulse™ power control

The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology. With the added assurance of energy traceability and closed-loop power control that Precision Pulse™ provides, RedStone XP is a low-risk investment.

Enhanced Productivity

With RedStone’s high frequency laser technology and the 5335’s real-time power control capability, RedStone XP achieves high productivity at low cost for a larger range of applications.

Precision Pulse™ Power Control

Reduce your yield loss even for challenging depth-limited processes using ESI’s industryleading Precision Pulse™ power control. This feature continuously measures and adjusts the energy of every laser pulse that touches your material to ensure robust process quality every time.

Trusted Yields, Trusted Partner

RedStone XP applies ESI’s decades of laser-material interaction expertise to provide higher performance. This enables FPC manufacturers to drill high-density designs with an increased yield— while limiting incidental damage.

Confident processing of high-quality vias, with the best UV nsec routing on market

  • ESI-patented compound beam positioning technology
  • Automated vision system for alignment and scaling compensation
  • Multi-language operator user interface
  • Sophisticated process development functionality
  • Comprehensive logging and diagnostics functionality

Processes

  • Through via drilling (THV)
  • Flex and interconnect processing
  • Blind via drilling (BHV)
  • Routing
  • Coverlay routing

Materials

  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (FR4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

Specifications

  • Type
    Cross-axis brushless linear motor with digital galvanometer
  • Laser
    Nanosecond UV
  • Pulse Rate
    100-300 kHz
  • Laser Output Power
    20 W @ 100 kHz
  • Panel Size
    533 x 635 mm
  • Accuracy
    ±20 μm over entire panel area
  • Maximum Average Velocity
    500 mm/s
  • Peak Move Speed
    2,000 points per second
  • Controller
    ESI Custom DSP based controller
  • Interface
    Software, mechanical and electrical interfaces provide the capability to attach web and panel material handlers to the system.
  • Vacuum Chuck
    533 x 635 mm (±20 um accuracy)

Resources