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This product has been replaced by the Geode-G2.
Specifications
- Average Power>300 W @ 6.5 kHz
- Peak Power2.5 kW
- Panel ProcessingDual-head two panel system
- Panel Size Range16x20 in. to 22x24 in.
- Panel Height DetectionTouchdown sensor (calibrated to align with camera focus)
- Part Thickness Range40 to 2000 um
- Energy MonitoringReal time pulse energy monitoring (programmable alarm settings)
- Automation Accuracy500 um (panel to chuck)
- ProcessingCDD/Large Window/Conformal Mask/LTH
- Scan Area20x20mm (ESI’s patented Third DynamicsTM beam positioning technology)
- Scan Frequency(per head): 5200 points per second (500 um pitch)
- ThroughputUp to 9500 pps
- Automation Panel Autoloaderstd, NG panel, Flipping
- Total System Accuracy+/- 8 um mean +3Σ
- Via Diameter Range35-200 um
- Laser Pulse FrequencyUp to 6.5 kHz
Resources & Downloads
Application Notes
Rigid PCB Processing Non-Copper Clad Dielectric Material Via Drilling Laser Direct Drilling (LDD) Comformal Mask Processing
Videos
Geode C02 Via Drilling System in Action(7:16) Inside Making a Via with Geode™: AcceleDrill™ Edition(2:13) Inside Making a Via with Geode™: Hypersonix™ Edition(1:59) Inside Making a Via with Geode™: RTPC Edition(2:39) Intra-pulse Beam Steering for High Density Interconnect via Drilling(18:18) Geode™ CO2 Laser Via Drilling Solution Meeting the Challenges of New Material and PCB Designs(1:41) Laser Drilling Solution for Precision Processing of Your HDI, SLP and ICP Applications(1:41)
Data Sheets
Geode Data Sheet(455.8 kB, PDF)