Flex PCB Laser Processing Systems

ESI's flex PCB laser processing systems excel in accuracy, power control, reliability and productivity. That helps our customers achieve higher quality production output with higher yields and lower overall cost of ownership. For applications ranging from simple coverlay cutting to advanced high-speed blind via drilling and circuit patterning processes, ESI’s flex systems are the solution of choice among the top PCB manufacturers worldwide.

	Capstone	5335	Redstone	RedStone XP	LodeStone
Overview	Highest Throughput & via Quality	Flex Industry Standard	Economincal System with Broad Capabilities	Economincal System with Broad Capabilities	Shortest Pulse Widths with High Reliability
Value Scale	✓✓✓✓	✓✓✓	✓✓	✓✓
Positioning	Advanced Tertiary Positioning	Tertiary Positioning	Stage and Galvo Positioning	Stage and Galvo Positioning	Stage and Galvo Positioning
Maximum Average Velocity	10,000 mm/s	1,000 mm/s	500 mm/s	500 mm/s	500 mm/s
Peak Move Speed		14,000 points per second	2,000 points per second	2,000 points per second	2,000 points per second
Laser	esiFlex™ ns UV	ns UV Nd:YAG	ns UV	ns UV	fs Green Fiber
Pulse Rate	300 kHz (for via)	40 to 90 kHz (for via)	100-200 kHz	100-300 kHz	Up to 1 MHz
Average Work Surface Power	11.4 W @ 300 kHz	6.6 W @ 40 kHz	14 W @ 100 kHz		7.8 W @ 1 MHz