Flex PCB Laser Processing Systems
ESI's flex PCB laser processing systems excel in accuracy, power control, reliability and productivity. That helps our customers achieve higher quality production output with higher yields and lower overall cost of ownership. For applications ranging from simple coverlay cutting to advanced high-speed blind via drilling and circuit patterning processes, ESI’s flex systems are the solution of choice among the top PCB manufacturers worldwide.
 Capstone |
 5335 |
 Redstone |
 RedStone XP |
|
|---|---|---|---|---|
| Overview | Highest Throughput & via Quality | Flex Industry Standard | Economincal System with Broad Capabilities | Economincal System with Broad Capabilities |
| Value Scale |
✓✓✓✓ |
✓✓✓ |
✓✓ |
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| Positioning | Advanced Tertiary Positioning | Tertiary Positioning | Stage and Galvo Positioning | Stage and Galvo Positioning |
| Maximum Average Velocity | 10,000 mm/s | 1,000 mm/s | 500 mm/s | 500 mm/s |
| Peak Move Speed | 14,000 points per second | 2,000 points per second | 2,000 points per second | |
| Laser | esiFlex™ ns UV | ns UV Nd:YAG | ns UV | ns UV |
| Pulse Rate | 300 kHz (for via) | 40 to 90 kHz (for via) | 100-200 kHz | 100-300 kHz |
| Average Work Surface Power | 11.4 W @ 300 kHz | 6.6 W @ 40 kHz | 14 W @ 100 kHz |