Non Clad

Dielectric materials for processing PCB and ICP applications where no Cu-cladding is required during lamination.

Typically, these are used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applications.

Example materials include: ABF, Green sheet (LCC), Ceramic (Si3N4)

Process Limitations

  • Non Cu-clad applications typically require low power, long pulse width laser profiles
  • There can be some throughput limitations (depending on applicable Geode configuration and via specs)
  • Material handling (limited protection)"


  • Low power
  • High throughput (depending on application)
  • More consistent via geometry (no glass fibers)

See the Geode CO2 Laser Via Drilling System in action.

Are you ready to elevate your  Non Clad processing?