Dielectric materials for processing PCB and ICP applications where no Cu-cladding is required during lamination.
Typically, these are used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applications.
Example materials include: ABF, Green sheet (LCC), Ceramic (Si3N4)
See the Geode CO2 Laser Via Drilling System in action.
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