Laser Direct Drilling
Drilling process used for via formation (BVH & LTH) in a variety of dielectric materials, typically requiring some pre process preparation (thinned Cu, oxide treatment, etc.). The first LDD pulse (or burst) is critical in this via drilling process, as it typically defines the via opening size and roundness. 3-12um Cu: oxide required
Advantages
See the Geode CO2 Laser Via Drilling System in action. Are you ready to elevate your Laser Direct Drilling? |
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