Conformal Mask (1)

Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.

Standard on >12um Cu Thickness

Process Limitations
• The etching process doesn’t allow the alignment of the vias to the signal layer, and there is no correction of individual shrinkage orstretch possible
• Additional processes/systems required to remove Cu

• No oxide treatment necessary
• Thicker outer layer Cu possible
• Typically low overhang"

See the Geode CO2 Laser Via Drilling System in action.

Are you ready to elevate your conformal mask processing?