Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.
Standard on >12um Cu Thickness
Process Limitations • The etching process doesn’t allow the alignment of the vias to the signal layer, and there is no correction of individual shrinkage orstretch possible • Additional processes/systems required to remove Cu
Advantages • No oxide treatment necessary • Thicker outer layer Cu possible • Typically low overhang"
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For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
