Precision, Accuracy & Speed to Optimize Production

ESI delivers market-leading solutions for Flexible PCB laser processing, HDI PCB laser processing and high-speed MLCC testing. Our solutions help manufacturers optimize production of the materials, components and systems integral to modern electronic devices.

Flex PCB Processing
Rigid PCB Processing
MLCC Testing
Medical Device Metrology

High-performance breakthrough productivity for flex PCB UV drilling

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CapStone™ High Speed Flex-PCB Laser via Drilling System

Geode™ CO2 Via Drilling System For FCBGA (ABF) IC Substrates

High-precision, high throughput CO2 via drilling for HDI PCB manufacturing and IC packaging

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PCB Applications
Flex Applications
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