Are your current CO2 systems ready to optimize your production?
Discover innovative technology features for smaller vias, faster throughput, and higher accuracy to meet your precise production demands. Let Geode’s innovative capabilities maximize your capacity and elevate YOUR production.
CO2 via drilling for HDI PCB manufacturing.
Take advantage of our powerful new CO2 laser and a new set of control capabilities. Leverage ESI’s decades of laser-material interaction experience and application expertise to innovate and stay ahead.
- PCB Manufacturing
- Integrated circuit packaging
- Substrate processing
- System level packaging
CO2 Via Drilling For FCBGA(ABF) IC Substrate Manufacturing .
The Geode A laser drill combines special laser/optics configuration with precision pulse shaping and steering specifically designed for ABF materials. Geode’s technology enables a greener manufacturing solution through 21% less floor space 72% less weight and up to 65% less power consumption than the competition. The combination of QCW laser and AOD technology also ensures highest throughput and lowest cost of ownership for our customers.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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