Higher productivity and higher yields for lower cost of ownership.
The RedStone XP™ system adopts proven design innovations from our premier products to deliver the ideal FPC processing solution for job shops facing significant product mix uncertainty. Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology. With the added assurance of energy traceability and closed-loop power control that Precision Pulse™ provides, RedStone XP is a low-risk investment.
Enhanced Productivity
With RedStone’s high frequency laser technology and the 5335’s real-time power control capability, RedStone XP achieves high productivity at low cost for a larger range of applications.
Reduce your yield loss even for challenging depth-limited processes using ESI’s industryleading Precision Pulse™ power control. This feature continuously measures and adjusts the energy of every laser pulse that touches your material to ensure robust process quality every time.
RedStone XP applies ESI’s decades of laser-material interaction expertise to provide higher performance. This enables FPC manufacturers to drill high-density designs with an increased yield— while limiting incidental damage.