CO2 via drilling for HDI PCB manufacturing and integrated circuit packaging.
Innovative CO2 laser technology, new control capabilities and applied expertise gained through decades of engineering leadership in flex, combine to deliver breakthrough levels of accuracy, throughput and yield.
Take a look at the latest innovations for HDI PCB Manufacturing and Integrated Circuit Packaging. Discover how the Geode can help you innovate and stay ahead.
Outpace your competition by increasing your Rigid PCB throughput by drilling multiple via diameters in a single pass. Geode™ will enable you to process an extensive dynamic range of via size without changing the spot size.
Your traditional Rigid PCB via drilling system may need several pulses to ablate copper & material, reducing your production yield. Increase your throughput and accuracy with Geode’s pulse chopping capabilities to ablate copper and material with minimal pulses.
Discover how you can increase stability and via quality with the industry’s only real-time power control. Geode™ will enable you to actively manage power fluctuation to ensure higher productivity in your Rigid PCB processing.
Accuracy - Via density compensation improves via diameter stability, accuracy and throughput.
Footprint - Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
Integrated structural air flow supports improved thermal equilibrium and simplified maintenance.
Easy-access design improves serviceability, decreasing maintenance and service downtime.