UV Laser Technology enables smaller focus beam sizes to drill smaller via geometries for High Precision and High-Speed IC Substrate Manufacturing. Geode platform technology enables a greener manufacturing solution through reduced floor space, weight, and power consumption compared to traditional laser drilling tools.

AcceleDrill™ Spatial Distribution in Action

Improves productivity by allowing a single pass over a panel without having to switch between different optical configurations to control via geometry. Geode™ will enable you to process an extensive dynamic range of via size without changing the spot size.

HyperSonix™ Time & Power in Action

Your traditional Rigid PCB via drilling systems may need several sequential process steps in order to optimize ablation in a traditional material stack. Increase your throughput and accuracy with Geode’s real-time pulse control capability to optimize the material ablation process.  

RTPC - Monitor & Control in Real Time

Discover how you can increase stability and via quality with the industry’s only real-time power control. Geode™ will enable you to actively manage power fluctuation to ensure higher productivity in your Rigid PCB processing.

LiteDesign™

Footprint - Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.

VDC™

Accuracy - Via density compensation improves via diameter stability, accuracy and throughput.

UpTime™

Easy-access design improves serviceability, decreasing maintenance and service downtime.