Via drilling solutions to meet the evolving challenges faced in PCB fabrication, IC packaging and substrate processing.
As a leading provider of laser via drilling solutions, ESI applies decades of innovation and laser processing expertise to the challenges faced by customers focused on optimizing their production capabilities and lowering production costs. Our via drilling solutions are purposefully engineered to deliver the combination of speed, accuracy and performance our customers need in order to meet the evolving set of challenges driven by a more mobile and connected world. It’s no coincidence that the world’s top 10 flexible circuit manufacturers trust ESI with their production. Our market leadership in via drilling is driven by a focus on providing quality, reliability and low cost-of-ownership that extends across the entire via drilling systems portfolio. Regardless of the application; from the most simple coverlay cutting to advanced microvia drilling for HDI processing and IC packaging, ESI is the clear industry choice.
Flex Interconnect Products
Our systems excel in accuracy, power control, reliability, and productivity to achieve lower overall cost of ownership for applications ranging from the most simple coverlay cutting to today’s most advanced microvia drilling and circuit patterning processes. This makes ESI the clear industry choice.
Circuit Packaging Products
CornerStone helps circuit packaging manufacturers meet the via drillling demands of processing next-generation products. CornerStone allows manufacturers to easily address a wide range of design requirements for smaller vias at a low total cost of ownership.
High Density Interconnect Products
High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials.
Maintain high-volume manufacturing with flex PCB materials.
RollMaster™ by Northfield Automation extracts maximum performance out of your ESI flexible circuit laser drilling tools. Blaze through material using ESI Model 5335’s maximum 1.5G stage acceleration with the RollMaster’s proprietary lightweight dancer design. Reduce your cycle time with RollMaster’s high-speed web indexing.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.