Synthesis: Illuminating Advances in Laser Processing
2024
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Atotech and ESI to participate in IPC APEX EXPO Atotech and ESI will participate in this year’s IPC APEX EXPO 2024, the PCB industry’s largest event in North America, to be held in Anaheim, California, to be held from April 6-11 2024 at the Anaheim California Convention Center. |
March 25, 2024 Ryan Wagner |
2023
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SPOT ON is Here Adding SPOT ON™ to CapStone™ enables our partners to drill the highest quality blind vias within increasingly tight margins. In our initial evaluations at high volume production partners, we have seen SPOT ON™ deliver increased yield on top of the already high CapStone™ laser drill performance. |
January 24, 2023 Ryan Wagner |
2022
| Description | Date | |
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Greg Stough Senior Service Analyst The MKS | ESI team is excited to introduce you to the newest member of our world-class customer service organization. Get to know Greg Stough. |
August 4, 2022 Ryan Wagner |
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First Cell Phone It started on April 3, 1973, with Martin Cooper, a Motorola employee, on a bustling corner of New York City. A quick hello to a fellow researcher and key rival in creating the first cell phone. |
April 1, 2022 Ryan Wagner |
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Laser Direct Drilling Laser Direct Drilling is used for via formation (BVH & LTH) in a variety of dielectric materials, typically requiring some pre process preparation (thinned Cu, oxide treatment, etc.). The first LDD pulse (or burst) is critical in this via drilling process, as it typically defines the via opening size and roundness. |
March 29, 2022 Ryan Wagner |
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Non-Cu Clad Via Drilling Dielectric materials where no copper cladding is required during lamination are typically used in semi-additive plating, modified semi-additive (mSAP), MLCC, or other such applications. |
March 25, 2022 Ryan Wagner |
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Karthik Ravi Product Marketing MLCC The MKS | ESI team is excited to introduce you to our new product marketing leader within our MLCC team, Karthik Ravi. |
March 9, 2022 Ryan Wagner |
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Comformal Mask Processing Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations. |
Febuary 25, 2022 Ryan Wagner |
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Beyond the Photon: Engineering Innovation In this innovation episode of Beyond the Photon, we got the opportunity to sit down with Flex Engineering Senior Manager Joe Hasty. |
Febuary 14, 2022 Ryan Wagner |
2021
| Description | Date | |
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Accelerate Material Processing Innovations With 40 years of leadership in laser material interaction technology and via drilling precision, we can partner with you to process the latest material and PCB designs for future 5G and miniaturization market trends. |
December 17, 2021 Ryan Wagner |
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ESI CapStone System Receives Innovators Award “On behalf of the Laser Focus World Innovators Awards, I would like to congratulate MKS Instruments on their Gold level honoree status,” said Laser Focus World Publisher Paul Andrews. “This competitive program allows Laser Focus World to celebrate and recognize the most innovative products impacting the photonics community this year.” |
September 21, 2021 Ryan Wagner |
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Process Development Tips and Tricks for Effective Flex Circuit Laser Processes Optimizing PCB laser processing for production requires a holistic view of the laser processes and their place in the production line. Taking the time to understand how those factors interact allows you to make informed decisions about where to focus your efforts and helps you to create a production process that effectively supports your organization’s unique set of operational goals. |
August 5, 2021 Ryan Wagner |
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Geode Expands HDI Footprint [PRESS RELEASE] PORTLAND, Ore. – July 20, 2021 – MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced confirmation of an order for the ESI® Geode™ HDI via drilling system from TTM Technologies, Inc. |
July 20, 2021 Ryan Wagner |
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Installation, Training and Initial Operation: Get Your New System Processing Those First Runs Optimizing PCB laser processing for production requires a holistic view of the laser processes and their place in the production line. Taking the time to understand how those factors interact allows you to make informed decisions about where to focus your efforts and helps you to create a production process that effectively supports your organization’s unique set of operational goals. |
July 1, 2021 Ryan Wagner |
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Beyond the Photon: Long Live the Via Long Live the Via. In this special edition episode of Beyond the Photon, we got the opportunity to sit down with Senior Director of Product Marketing, Todd Templeton. |
June 9, 2021 Ryan Wagner |
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Readiness and Site Preparation: Getting your facilities ready for laser processing It’s fairly common for manufacturers to overlook some of the cost factors associated with upgrading facilities to accommodate the addition of new processing methodologies. For PCB manufacturers considering the addition of laser processing for flex circuit production, there is an entirely new set of considerations to be aware of and to manage effectively if they plan to step into flex PCB laser processing. |
June 8, 2021 Ryan Wagner |
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Calculating and Optimizing Production: How to optimize total system cost of ownership When it comes to laser processing for flex PCB, how do you calculate and optimize total system cost of ownership (TCO) and cost per panel (CPP)? |
May 24, 2021 Ryan Wagner |
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Manufacturing flow and considerations in adopting laser processing capabilities Market demand for smaller, faster, wearable, lighter and more powerful devices continues to keep PCB manufacturers scrambling to keep up as they evolve and adapt their manufacturing capabilities to meet changing customer needs. But keeping up with the dizzying pace of change in the world of PCB manufacturing need not be a daunting task. |
May 17, 2021 Ryan Wagner |
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Beyond the Photon: HDI Episode Check out the latest Beyond the Photon episode as we have an insightful discussion on the latest trends in via drilling for HDI PCB manufacturing and integrated circuit packaging |
February 24, 2021 Ryan Wagner |
2020
| Description | Date | |
|---|---|---|
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Capstone Sees Strong Market Demand [PRESS RELEASE] “CapStone has definitely been a game changer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “As Flex PCB manufacturers continue to upgrade their processing capabilities to address new technologies such as 5G, the CapStone system is enabling them to take advantage of latest-generation laser technology to stay current in a very competitive market.” |
December 02, 2020 Ryan Wagner |
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Intra-pulse beam steering for High-Density-Interconnect via drilling Discover how innovations in laser performance, and high bandwidth beam positioning combined with the ability to do high-level laser material interaction modeling, has enabled the development of new innovative applications. Specifically looking at the innovation of intra-pulse beam steering for state-of-the-art high-density interconnect via drilling. |
September 11, 2020 Ryan Wagner |
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MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution [Press Release] According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko, “Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. |
September 03, 2020 Ryan Wagner |
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Beyond the Photon: Building the I-5G Corridor We got the opportunity to speak with a MKS Director of Product Marketing in the mighty photon podcast lab and asked him 3 big questions on 5G. He compares country roads with interstate freeways to explain the arrival of 5G and the new applications that will spring up along the I-5G corridor. |
June 25, 2020 Ryan Wagner |
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MKS® Instruments Sells 1,000th ESI® 5335™ System The 1,000th system rolled off the manufacturing line in Singapore in March and is destined for the Vietnam production facility of the Sonova Group, based in Stäfa, Switzerland. “This will be our fifth 5335 system,” said Stephan Kaderli, Director Operations SOCS at Sonova. “As a global company that relies on global support, it’s important that we have systems we can rely on. |
April 13, 2020 Ryan Wagner |
Ultra-High Velocity