PCB Fabrication and Substrate Processing
A range of via drilling solutions to drive innovation and maintain competitive advantage. Meet requirements for smaller microvias and higher feature density for flex PCB, IC packaging and HDI via drilling applications.
Wafer processing solutions that enable you to maintain high-volume production, even when incorporating new materials such as low-k dialectrics and thin wafers, without sacrificing yield. Wafer scribing, dicing, marking and memory repair.
ESI delivers adaptable laser micromachining platforms to transform a wide range of materials and a series of laser ablation systems for material characterization.
The world is transforming. ESI is focused on delivering new and innovative micro-manufacturing solutions that empower our customers to build the products that transform lives.
The development of this new technique provides our customers the ability to generate data across the periodic table at detection limits superior to traditional methods in a very cost effective manner.Jon Landau, Vice President of the Geoanalytical Division, Bureau Veritas Minerals
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.