Optimized for productivity.
Built for the lowest cost of ownership.
Designed for the most advanced materials.
CO2 Laser System for High Precision and High-Speed ABF IC Substrate Manufacturing. Geode’s technology enables a greener manufacturing solution through 21% less floor space 72% less weight and up to 65% less power consumption than the competition.
Outpace your competition by increasing your Rigid PCB throughput by drilling multiple via diameters in a single pass. Geode™ will enable you to process an extensive dynamic range of via size without changing the spot size.
Your traditional Rigid PCB via drilling system may need several pulses to ablate copper & material, reducing your production yield. Increase your throughput and accuracy with Geode’s pulse chopping capabilities to ablate copper and material with minimal pulses.
Discover how you can increase stability and via quality with the industry’s only real-time power control. Geode™ will enable you to actively manage power fluctuation to ensure higher productivity in your Rigid PCB processing.
Footprint - Compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
Accuracy - Via density compensation improves via diameter stability, accuracy and throughput.
The MKS beam characterization tool offers precision in-line laser/optical evaluation and control for improved calibration and via consistency.
Easy-access design improves serviceability, decreasing maintenance and service downtime.