Over 40 years of applied technology expertise in via drilling.
The demand for ever-smaller microvias and higher feature density in increasingly delicate flexible and rigid-flex circuits is driving increased worldwide adoption of ESI systems. Whether your application involves flex circuit processing, high-density interconnect (HDI) processing or IC Packaging, ESI’s laser-based PCB processing solutions provide a range of via drilling solutions to meet your requirements.
Flex Interconnect Solutions
The demand for ever-smaller microvias and higher feature density in increasingly delicate flexible and rigid-flex circuits is driving increased worldwide adoption of ESI systems. Nine of the world’s top 10 flexible circuit manufacturers trust ESI with their bare board production. Our systems excel in accuracy, power control, reliability, and productivity to achieve lower overall cost of ownership for applications ranging from the most simple coverlay cutting to today’s most advanced microvia drilling and circuit patterning processes. This makes ESI the clear industry choice.
Circuit Packaging Solutions
CornerStone helps circuit packaging manufacturers meet the via drillling demands of processing next-generation products. With its unique combination of high-accuracy via formation at small sizes, high-volume throughput capabilities and an industry-leading footprint size, CornerStone allows manufacturers to easily address a wide range of design requirements for smaller vias at a low total cost of ownership.
High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership.
Process a wide variety of materials at higher quality and faster throughput with less operator intervention and more uptime; helping FPC manufacturers and their subcontractors to extend their processing services into a broader set of market opportunities involving the processing of new materials.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.