Debris-free 100-200mm Soft Mark Wafer Marking.


SigmaClean — Soft marking 100-200mm wafers

SigmaClean’s Class 1 cleanroom compatibility and ultra-stable patented diode-pumped laser has helped to make it the industry-leading solution for cost-efficient, highly-readable soft marking of 100 mm to 200 mm wafers for identification and traceability. SigmaClean can place multiple mark groups at any orientation on the wafer surface, within a 25mm band around the wafer’s circumference.

OVERVIEW


The industry-leading SoftMark solution.

MARKETS:
  • Semiconductor Manufacturing
APPLICATIONS:
  • Soft Mark Wafer Marking
MATERIALS:
  • Silicon

SPECIFICATIONS


Patented SuperSoftMark® Technology

LASER :
  • Type: Acousto-optic Q-switched TEM00 ND:YLF diode pumped
  • Wavelength: 1053nm
  • Pulse to Pulse Stability: <0.5% at 1 kHz
  • Optics: Flat field focusing lens
  • Spot Size: 50, 60 or 70 μm
  • Depth: 2.5 to 5.0 μm
WAFER HANDLING:
  • Wafer Size: 100-200mm
  • Alignment: Optical high-resolution wafer aligner
  • Water Transport: Pick & place robot arm with single end effector
  • I/O Ports: Two fixed FOUP carrier load ports

FEATURES & OPTIONS


  • Fully compliant with SEMI standards for wafer marking: T7, M12 and M13.
  • SigmaClean can place multiple mark groups at any orientation on the wafer surface, within a 25mm band around the wafer's circumference.

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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