Maintain high die-break strength and minimize heat-affected zones to deliver production throughput without risk of damage to the underlying device.

Ultrafast laser grooving solution for next-generation low-K materials and thin wafers.

The Ultrus wafer grooving solution enables semiconductor manufacturers to optimize their production capabilities and meet production challenges related to processing current and next-generation materials and thin wafers. Ultrus systems apply ultrafast high-pulse-rate laser processing technology to easily integrate new materials into the wafer processing workflow.

Ultrus delivers a low cost-of-ownership solution for the combined challenges of newer materials and thin wafers, and the need to maintain high-volume production throughput. 

The ultrafast laser technology employed in Ultrus enables chip manufacturers to incorporate leading-edge processing techniques into their production operation, and still maintain high die break strength and minimize heat affected zones. Allowing for more precise removal of metal layers and fragile materials from dicing streets from a wider range of materials—without damaging the underlying device. The result is higher production quality and higher backend yields.


Gain throughput and yield advantage without sacrificing quality.

  • Semiconductor Foundries
  • FPGA Manufacturers
  • DRAM Manufacturers
  • SSD Manufacturers
  • OSATs
  • Laser Grooving/Scribe
  • Silicon


Ultrafast laser technology platform.

  • Type: Mode locked
  • Pulse width: < 1 ps
  • Max Pulse rate for grooving: 1.25 MHz
  • Average Power at work surface: > 15W
  • SEMI standard: 300mm tape frame
  • Cassette Stations: 2


  • Coat: Atomizing spray
  • Clean: Rinse, plus high- pressure wash

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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