Model 9850TPIR+, dual-beam, tailored-pulse laser link-processing system.

Address memory repair challenges with leading edge technology and decades of applied laser application expertise.

ESI is pushing boundaries with semiconductor laser fuse processing. With state-of-the-art laser positioning, ESI's world-class production systems use precise laser energy to boost yields in the production of next-generation devices for DRAM, SRAM, embedded memory and other laser-fuse applications.

The result: repair costs below one half of one percent of overall die costs, the ability to shrink die geometries, and an up-to-100% increase in the number of functional devices on each wafer.

Look to ESI to deliver ultra-small spot size, ultra-throughput and ultra-yields.


The 9850TPIR+ is designed to meet the needs of a variety of DRAM, FLASH and embedded memory devices.

The requirements of new generations of high-speed chips are driving the industry towards increased wiring density and increased interconnect complexity. Additional metal interconnect layers (Cu and Al) are being added that impact the variability and thickness of the overlying fuse dielectric and other fuse topography variations.

The 9850TPIR+ addresses those challenges with leading edge technology and decades of applied laser application expertise.

The 9850TPIR+ features ESI’s Proprietary Tailored Pulse Laser for advanced capability beyond that of existing diode-pumped and fiber laser sources.

The laser pulse temporal profile of the 9850TPIR+ can be programmed to a wide variety of shapes and customized to the requirements of a particular device. One example of a Tailored Pulse shape is the “chair shaped pulse.” This has been optimized to provide a high peak of energy with a fast rise time that ruptures the overlying fuse dielectric quickly and efficiently. The pulse is then quickly attenuated, and a lower energy is applied to cleanly remove the remaining fuse material. This combination of efficient oxide removal and “gentle” cleaning out of the remaining metal, gives an unprecedented increase in process window and highest yields.

learn more about the 9850TPIR+

  • Fuse processing
  • CU and AI interconnect layers

For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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