Leverage ultrafast high-pulse-rate lasers and ESI’s proprietary beam positioning technology.
The adoption of more fragile materials and thinner wafers in the production process has presented semiconductor manufacturers with challenges related to maximizing throughput and accuracy while minimizing the risk of damage to the underlying device. ESI's ultrafast, high-pulse-rate laser technology helps you meet those challenges; to deliver higher yields at high-volume throughput...and at a lower total cost of ownership.
Memory Repair Products
ESI is pushing boundaries with semiconductor laser fuse processing. ESI's world-class production systems use precise laser energy in the production of next-generation devices for DRAM, SRAM, embedded memory and other laser-fuse applications.
- Repair costs below one half of one percent of overall die costs.
- Ultra-small spot size.
- State-of-the-art laser positioning.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.