Leverage ultrafast high-pulse-rate lasers and ESI’s proprietary beam positioning technology.
The adoption of more fragile materials and thinner wafers in the production process has presented semiconductor manufacturers with challenges related to maximizing throughput and accuracy while minimizing the risk of damage to the underlying device. ESI's ultrafast, high-pulse-rate laser technology helps you meet those challenges; to deliver higher yields at high-volume throughput...and at a lower total cost of ownership.
ESI’s wafer scribing solutions employ ultrafast high-pulse-rate lasers and ESI’s proprietary beam positioning technology to provide a high-throughput, high-accuracy grooving solution that addresses the challenges associated with processing thinner and more fragile materials.
- Processing thinner and more fragile materials.
- Limit the risk damage to the underlying devices.
Memory Repair Products
ESI is pushing boundaries with semiconductor laser fuse processing. ESI's world-class production systems use precise laser energy in the production of next-generation devices for DRAM, SRAM, embedded memory and other laser-fuse applications.
- Repair costs below one half of one percent of overall die costs.
- Ultra-small spot size.
- State-of-the-art laser positioning.
Wafer Marking Products
WaferMark series laser systems from ESI are the recognized leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification.
- Unsurpassed mark quality with our hardmark and patented SuperSoftMark® processes.
- Improved traceability and product identification.
- Hard mark and soft mark options.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.