Get the CapStone Advantage!

New-generation laser technology and control capabilities to deliver breakthrough productivity.


Increase throughput up to 2X! Reduce overall processing costs by up to 30%.

As a part of ESI’s market-leading family of flex PCB processing systems, CapStone™ leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.

  • Cut processing time by up to and beyond 2x
  • Minimize heat-affected zones
  • Increase yields
  • Lower per-panel processing costs

 

The CapStone Advantage

DynaClean™ CapStone’s blind via processing speeds are significantly higher due to the incorporation of ESI’s new DynaClean™ feature using ESI’s patented esiLens™ technology. In a single pass, DynaClean™ processes both copper opening and dielectric cleaning steps that previously required multiple passes. This eliminates unproductive feature-to-feature movement time and enables significantly faster throughput than the 5335 and other UV laser systems, while delivering the same quality of via formation.

AcceleDrill™ Building on the 5335’s Third Dynamics™, ESI’s latest evolution of beam positioning technology minimizes heat effects with up to and beyond 10m/s via drilling process velocities. As a part of ESI’s market-leading family of flex PCB processing systems, CapStone leverages ESI’s new laser technology, fluence control and beam positioning. This combination delivers the fastest blind via processing times in the industry and enables FPC processors to process a wider range of materials at high yields and high productivity with minimum process development and maximum uptime. CapStone significantly reduces cost of ownership for the full spectrum of applications and pattern densities considered by leading flex circuit manufacturers.

  • Cut processing time by up to and beyond 2x
  • Minimize heat-affected zones
  • Increase yields
  • Lower per-panel processing costs

esiFlex™ Laser CapStone’s high-performance, custom-designed esiFlex™ Laser drives higher performance while minimizing processing costs.

SUMMARY


The leader in Flex PCB laser via drilling

MARKETS:
  • Flex PCB Laser Processing
  • Rigid-Flex Laser Processing
APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

SPECIFICATIONS


High performance Flex PCB UV drilling

LASER:
  • esiFlex™ high PRF nsec UV
MATERIAL HANDLING:
  • Vacuum chuck - 533mm x 635mm (±15um accuracy)
  • Electrical and software interface for web and panel handler integration

FEATURES & OPTIONS


Leverage new technology for higher quality and yield

  • Acceledrill™ and Third Dynamics™ beam positioning
  • Dynaclean™
  • Precision Pulse™ digital power control
  • Automated vision system for alignment and scaling compensation
  • Easy-to-use Windows 7 interface
  • Multi-language operator user interface
  • Sophisticated process development functionality
  • Comprehensive logging and diagnostics functionality

As the recognized leader in flex PCB processing, ESI has decades of applied expertise in laser via drilling and production-oriented Flex PCB laser processing. Learn more about ESI’s portfolio of laser via drilling systems and see how you can incorporate flex PCB laser processing to help address flex PCB manufacturing challenges.

Let ESI help fuel your drive for innovation – contact an ESI Representative today.