An advanced laser platform for high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.
Production-oriented wafer trimming solution.
The M350 is a wafer trimming platform that leverages ESI’s 40 years of Laser-material expertise. It delivers high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.
WAFER TRIMMING PRODUCTS
The M350 maximizes throughput without sacrificing quality.
An advanced new platform for high precision, high throughput wafer-level optimization of linear and mixed signal IC devices.
- Next generation version of our field-proven WaferTrim™ technology.
- Fully integrated state-of-the-art laser trimmer and wafer prober system.
- Seamless integration to today’s ATEs via GSI Group’s Enhanced Tester Interface software and real-time tester interface hardware.
- Proven superior laser control ensures process consistency & highest yields
- Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
- New user-friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup files.
- Optional Lasers – Short (SP) & Long (LP) Pulse Duration.
APPLICATIONS:
- Trimming components on wafer substrate
MATERIALS:
- Thin film
- Thick film
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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