An advanced laser platform for high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.

Production-oriented wafer trimming solution.

The M350 is a wafer trimming platform that leverages ESI’s 40 years of Laser-material expertise. It delivers high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.

WAFER TRIMMING PRODUCTS

The M350 maximizes throughput without sacrificing quality.

An advanced new platform for high precision, high throughput wafer-level optimization of linear and mixed signal IC devices.

  • Next generation version of our field-proven WaferTrim™ technology.
  • Fully integrated state-of-the-art laser trimmer and wafer prober system.
  • Seamless integration to today’s ATEs via GSI Group’s Enhanced Tester Interface software and real-time tester interface hardware.
  • Proven superior laser control ensures process consistency & highest yields
  • Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
  • New user-friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup files.
  • Optional Lasers – Short (SP) & Long (LP) Pulse Duration.

learn more about the M350

APPLICATIONS:
  • Trimming components on wafer substrate
MATERIALS:
  • Thin film
  • Thick film

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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