
A high performance chip trim system designed specifically for thick film components down to the latest 01005 products.
- Spot size down to 20 microns
- Diode-pumped laser technology for minimum maintenance, long term stability and high reliability
- Patented beam calibration and vision system for automatic alignment and precise laser positioning
- High speed handler manages thin substrates used with the latest generation small geometry chip resistors
- Wide range measurement system
- 5 milli-Ohms to 1 Gig Ohm
- Traceable measurement certification
- ChipTrim™ Software
- Graphical user environment dedicated to chip trimming
- Globalized language support
The LT3100 delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT3100 utilizes the same resistor trimming platform for a wide range of production applications, customers experience a lower total cost of ownership.
SUMMARY
Receive high beam control accuracy and a high level of precision without sacrificing throughput.
MARKETS:
- Automotive
- Medical
- Aerospace
APPLICATIONS:
- Strain gauges
- Fuel gauges
- Rotary encoders
- Pressure sensors
- Thermistors
- Temperature Sensors
- Gearbox controllers
- Vehicle emission detectors
- Chip resistors
MATERIALS:
- Thick film
SPECIFICATIONS
Precision and accuracy in an extensible platform.
LASER:
- Type: Diode pumped Q-switched YAG
- Wavelength: 532nm
- Output Power / Pulse Width:
- 3W / 30ns
- 3W / 70ns (optional)
- 6W/70ns (optional)
- Beam positioner type: High-speed closed loop galvanometer
- Spot Size1: 8 μm - 15 μm
- Field size: 100 x 100 mm
- 50 x 50 mm (8 μm spot)
- 25 x 25 mm (8 μm optional)
- Depth of Focus: 150 μm 50 μm (8 μm spot)
- Beam Repeatability: ≤6.0 μm
- Resolution: 1.52 μm - 0.80 μm (8 μm spot)
MATERIAL HANDLING:
- Programmable Z Stage
- Z Travel: 20mm
- Z Resolution: 4um
- Z Repeatability: 4um
- Theta Travel: ± 5 degrees
- Theta Resolution: 0.003 degrees
- Lifting/Probe force: 25 lbs (11.3 kg)
FEATURES & OPTIONS
System Features
- Optional Equipment:
- Low-ohm option (5 mΩ – 1 Ω):
- Uses standard 4T probe cards
- Range 0.005 Ω – 0.1 Ω ±0.50%
- Accuracy 0.1 Ω - 1 Ω ±0.25%
- Additional matrix cards
- Choice of analog cables
- PCI IO card
- GPIB interface
- GPIB instrumentation package
- Configurable Light Tower
- Illumination options
- Service tools and accessories
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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