ESI’s market-leading CircuitTrim® solutions for thick film chip-R. Incorporating decades of applied laser expertise.

A high performance chip trim system designed specifically for thick film components down to the latest 01005 products.

  • Spot size down to 20 microns
  • Diode-pumped laser technology for minimum maintenance, long term stability and high reliability
  • Patented beam calibration and vision system for automatic alignment and precise laser positioning
  • High speed handler manages thin substrates used with the latest generation small geometry chip resistors
  • Wide range measurement system
    • 5 milli-Ohms to 1 Gig Ohm
    • Traceable measurement certification
  • ChipTrim™ Software
    • Graphical user environment dedicated to chip trimming
    • Globalized language support

The LT3100 delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT3100 utilizes the same resistor trimming platform for a wide range of production applications,  customers experience a lower total cost of ownership.

OVERVIEW

Receive high beam control accuracy and a high level of precision without sacrificing throughput.

MARKETS:
  • Automotive
  • Medical
  • Aerospace
APPLICATIONS:
  • Strain gauges
  • Fuel gauges
  • Rotary encoders
  • Pressure sensors
  • Thermistors
  • Temperature Sensors
  • Gearbox controllers
  • Vehicle emission detectors
  • Chip resistors
MATERIALS:
  • Thick film

SPECIFICATIONS

Precision and accuracy in an extensible platform.

LASER:
  • Type: Diode pumped Q-switched YAG
  • Wavelength: 532nm
  • Output Power / Pulse Width:
  • 3W / 30ns
  • 3W / 70ns (optional)
  • 6W/70ns (optional)
  • Beam positioner type: High-speed closed loop galvanometer
  • Spot Size1: 8 μm - 15 μm
  • Field size: 100 x 100 mm
  • 50 x 50 mm (8 μm spot)
  • 25 x 25 mm (8 μm optional)
  • Depth of Focus: 150 μm 50 μm (8 μm spot)
  • Beam Repeatability: ≤6.0 μm
  • Resolution: 1.52 μm - 0.80 μm (8 μm spot)
MATERIAL HANDLING:
  • Programmable Z Stage
  • Z Travel: 20mm
  • Z Resolution: 4um
  • Z Repeatability: 4um
  • Theta Travel: ± 5 degrees
  • Theta Resolution: 0.003 degrees
  • Lifting/Probe force: 25 lbs (11.3 kg)

FEATURES & OPTIONS

System Features

  • Optional Equipment:
  • Low-ohm option (5 mΩ – 1 Ω):
  • Uses standard 4T probe cards
  • Range 0.005 Ω – 0.1 Ω ±0.50%
  • Accuracy 0.1 Ω - 1 Ω ±0.25%
  • Additional matrix cards
  • Choice of analog cables
  • PCI IO card
  • GPIB interface
  • GPIB instrumentation package
  • Configurable Light Tower
  • Illumination options
  • Service tools and accessories

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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