QuikLaze

 Improve Failure Analysts to Maximize Yield


QuikLaze 50ST2 is a tool designed specifically for quick, easy removal of a variety of materials. Multiple, user-selectable wavelengths provide the capability to selectively remove specific materials while leaving others unaffected. A few examples of the procedures that can be efficiently performed using QuikLaze include:

  • Remove ITO shorts—cut metal traces on LCD panels 
  • Remove polyimide before FIB edits

The system can vastly improve yield for LCD production by quickly repairing defects and removing shorts. The QuikLaze laser system features an Advanced Beam Delivery System (ABDS). The ABDS enables precise cuts on a microscopic level for each of the three wave-length regions (infrared, visible or ultraviolet). The system also provides precise power control of the wavelength selectable beam without sacrificing the beam characteristics.

SUMMARY


Increase your IC Design Engineers Productivity

MARKETS:
  • LCD Repair
  • Failure Analysis
  • Micromachining
APPLICATIONS:
  • Material removal
  • Cutting circuit lines
MATERIALS:

SPECIFICATIONS


Choose standard configuration or multiple options for ultimate flexibility

STANDARD CONFIGURATION:
  • Laser head (vertical mount) with 2.5mm x 2.5mm aperture
  • XY Shutter (Std. Resolution)
  • Close-loop energy control
  • 2.4m umbilical
  • Power supply
  • Remote Control Panel
  • Foot switch
  • Video spot marker

FEATURES & OPTIONS



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For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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