Increase Performance for CapStone™ Flex PCB Drill System
Increase via drilling operational performance with CapStone’s SPOT ONTM feature upgrade:
- Higher Yield by reducing common via quality issues
- Reduced fleet and lot variability
- Reduced downtime with spot quality measurement for improved service planning
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Beam Location and Control Automatically measure and validate spot size and focus during production |
Panel Z Mapping Quickly and accurately measure surface height variations across the processing surface due to chuck, overlay and the material before processing. |
Realtime Z Control The system will automatically compensate for z-height fluctuations during production |
Discover the SPOT ONTM Advantage:
SUMMARY
Extending the CapStone's Yield Perfromance
APPLICATIONS:
- Blind Vias
- Through Hole Vias
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
SPECIFICATIONS
Extending the CapStone's Yield Perfromance
FOCUS CALIBRATION AND ACCURACY:
- Automatic Calibration
- Optical method
- Accurate to ~10um
- Assure Process Window is centered due to continual updating of focus calibration.
SPOT SIZE AND QUALITY :
- Verified on a user defined basis
- Data collected into easy-to-read SPC charts showing trends over time.
HEIGHT FLUCTUATION CONTROL:
- System measures and retains height map on a per job basis
- System auto-compensates during processing to maintain ideal focus position to within <30um across the work surface.
FEATURES & OPTIONS
Industry’s-first dynamic focus capability improves yield
- Beam Location Contol
- Panel Z-mapping
- Real time Z contol and automate measurment of beam qaulity parameters
