"High-end Flex PCB manufacturers are experiencing increased pressure to meet yield requirements," said John Williams, VP and General Manager of MKS Equipment and Solutions Business. "Adding SPOT ON™ to CapStone™ enables our partners to drill the highest quality blind vias within increasingly tight margins. In our initial evaluations at high volume production partners, we have seen SPOT ON™ deliver increased yield on top of the already high CapStone™ laser drill performance."
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
Dielectric materials for semi-additive and additive plating processes, typically for IC substrates. Discover its process limitations, advantages and how the Geode CO2 Laser Via Drilling
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
With 40 years of leadership in laser material interaction technology and via drilling precision, we can partner with you to process the latest material and PCB designs for future 5G and miniaturization market trends. Find two material posters below
한국 및 기타 신흥 시장의 고객들은 ESI RedStone XP를 통해 PCB 용 레이저드릴 캐파를 지속적으로 확장하고 있습니다.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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