Laser Direct Drilling
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
Non Clad
Dielectric materials for semi-additive and additive plating processes, typically for IC substrates. Discover its process limitations, advantages and how the Geode CO2 Laser Via Drilling
Conformal Mask (1)
Drilling process where the top Cu is removed by chemical etching or UV Laser. The aperture is then used as a mask for CO2 drilling into the dielectric material.Discover its process limitations,
Beyond the Photon: HDI Episode
Check out the latest Beyond the Photon episode as we have an insightful discussion on the latest trends in via drilling for HDI PCB manufacturing and integrated circuit packaging
Taking our Laser Show on the Road at CPCA 2019
Planning on attending CPCA 2019 at the Shanghai New International Expo Centre? Stop by our ESI exhibit, which is located within the WKK booth 7R16.
For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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