Press Release

MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

August 16, 2019

[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.

Capstone, Flexible Circuits, Press Release

ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

October 09, 2018

Laser Marketing Team

[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...

Press Release, Allegro LC, MLCC Testing

(Press Release) ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCs

October 01, 2018

Laser Marketing Team

ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCsNew system from market leader addresses MLCC test demand for consumer and automotive markets PORTLAND, Ore., Oct. 01, 2018 (GLOBE NEWSWIRE)

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MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

(Press Release) ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCs