[PRESS RELEASE] PORTLAND, Ore. – July 20, 2021 – MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced confirmation of an order for the ESI® Geode™ HDI via drilling system from TTM Technologies, Inc. (“TTM”), a major technology leader in the HDI PCB manufacturing market, for their facility in Guangzhou, China. The financial terms of the order were not disclosed.
Long Live the Via. In this special edition episode of Beyond the Photon, we got the opportunity to sit down with Senior Director of Product Marketing, Todd Templeton.
Check out the latest Beyond the Photon episode as we have an insightful discussion on the latest trends in via drilling for HDI PCB manufacturing and integrated circuit packaging
Intra-pulse beam steering for High-Density-Interconnect via drilling by Jan Kleinert - Research Director at ESI, a Division of MKS Inc.
[Press Release] According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko, “Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. Add to this the broad range of applications and materials that Geode can process, and the decision is clear.” READ FULL RELEASE
[official press relese] The new Geode CO2 laser drilling system for HDI rigid printed circuit board manufacturing combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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