Gallery of Vias

Gallery of Vias

Welcome to the Gallery of Vias

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Beyond the Photon: HDI Episode

Beyond the Photon: HDI Episode

Check out the latest Beyond the Photon episode as we have an insightful discussion on the latest trends in via drilling for HDI PCB manufacturing and integrated circuit packaging

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Intra-pulse beam steering for High-Density-Interconnect via drilling

Intra-pulse beam steering for High-Density-Interconnect via drilling

Intra-pulse beam steering for High-Density-Interconnect via drilling by Jan Kleinert - Research Director at ESI, a Division of MKS Inc.

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MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution

MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution

[Press Release] According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko, “Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. Add to this the broad range of applications and materials that Geode can process, and the decision is clear.” READ FULL RELEASE

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Introducing Geode

Introducing Geode

[official press relese] The new Geode CO2 laser drilling system for HDI rigid printed circuit board manufacturing combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package

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For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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