Beyond the Photon - Engineering Innovation
In this innovation episode of Beyond the Photon, we got the opportunity to sit down with Flex Engineering Senior Manager Joe Hasty.
MKS Instruments Sees Strong Adoption of its ESI® RedStone XP™ PCB Processing Systems
한국 및 기타 신흥 시장의 고객들은 ESI RedStone XP를 통해 PCB 용 레이저드릴 캐파를 지속적으로 확장하고 있습니다.
Stepping Up to Laser Processing for Flex: Chapter 4
Now it is time to get your new system installed and processing those first runs!
Beyond the Photon: Long Live the Via
Long Live the Via. In this special edition episode of Beyond the Photon, we got the opportunity to sit down with Senior Director of Product Marketing, Todd Templeton.
Stepping Up to Laser Processing for Flex: Chapter 3
How do you get your your facilities ready for the introduction of laser processing?
Stepping Up to Laser Processing for Flex: Chapter 1
Chapter 1: Laser technology for flex processing Manufacturing flow and considerations in adopting laserprocessing capabilitiesMarket demand for smaller, faster, wearable, lighter and more powerful
Laser Focus 5 | May 2020
Five stories about the world of lasers, technology, and innovation that is helping to push the boundaries of possibility. In this edition, SPIE celebrates the 60th anniversary of ruby laser-firing, the longest laser experiment in history, a website dedicated to the history of lasers, a flex patch repurposed for COVID 19, and fancy light inspired zoom backgrounds.
MKS® Instruments Sells 1,000th ESI® 5335™ System
The 1,000th system rolled off the manufacturing line in Singapore in March and is destined for the Vietnam production facility of the Sonova Group, based in Stäfa, Switzerland. “This will be our fifth 5335 system,” said Stephan Kaderli, Director Operations SOCS at Sonova. “As a global company that relies on global support, it’s important that we have systems we can rely on. The 5335 has proven itself over the years, and we are happy to be adding this system to our existing set of 5335s.”
HON-Flex Selects MKS®
“Although a majority of the work we do for them involves high-volume through-via drilling, they also have the need for us to process flex PCB’s that require blind vias. That meant that we needed a solution we could rely on to do both. After evaluating the RedStone system...
ZDT StrategicCooperation Partner Award
Zhen Ding Technologies (ZDT), a manufacturer of high density interconnects (HDI) and flexible printed circuit boards (PCBs), awarded our E&S division the Strategic Cooperation Partner award, recognizing unique technology in the FPC manufacturing process
Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology
[PRESS RELEASE] PORTLAND, Ore., Aug. 27, 2019 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a sale for the recently introduced ESI® CapStone™ printed circuit board (PCB) laser processing systems to Cicor.
Taking our Laser Show on the Road at CPCA 2019
Planning on attending CPCA 2019 at the Shanghai New International Expo Centre? Stop by our ESI exhibit, which is located within the WKK booth 7R16.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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