"High-end Flex PCB manufacturers are experiencing increased pressure to meet yield requirements," said John Williams, VP and General Manager of MKS Equipment and Solutions Business. "Adding SPOT ON™ to CapStone™ enables our partners to drill the highest quality blind vias within increasingly tight margins. In our initial evaluations at high volume production partners, we have seen SPOT ON™ deliver increased yield on top of the already high CapStone™ laser drill performance."
“On behalf of the Laser Focus World Innovators Awards, I would like to congratulate MKS Instruments on their Gold level honoree status,” said Laser Focus World Publisher Paul Andrews. “This competitive program allows Laser Focus World to celebrate and recognize the most innovative products impacting the photonics community this year.”
Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology
[PRESS RELEASE] PORTLAND, Ore., Aug. 27, 2019 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a sale for the recently introduced ESI® CapStone™ printed circuit board (PCB) laser processing systems to Cicor.
MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution
[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.
“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”
ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry
[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.