Sights from HKPCA 2018

Sights from HKPCA 2018

ESI's photon playground is laser-focused on showcasing world-class via drilling solutions. The power of the photon is on full display at ESI's booth during the 2018 HKPCA show.

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ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...

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For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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