Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology

Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology

[PRESS RELEASE] PORTLAND, Ore., Aug. 27, 2019 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a sale for the recently introduced ESI® CapStone™ printed circuit board (PCB) laser processing systems to Cicor.

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MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.

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ESI Receives Significant Asia Order

ESI Receives Significant Asia Order

“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”

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Sights from HKPCA 2018

Sights from HKPCA 2018

ESI's photon playground is laser-focused on showcasing world-class via drilling solutions. The power of the photon is on full display at ESI's booth during the 2018 HKPCA show.

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ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry

[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...

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For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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