Laser Seeding for the Preparation of Conductive Features on Glass Substrates

Laser Seeding for the Preparation of Conductive Features on Glass Substrates

“A novel process for the preparation of conductive features on glass substrates is presented. In this process, an ultrafast green laser is utilized to remove material from a transparent glass substrate, and a second laser source deposits Cu droplets through the laser-induced forward transfer of a donor film into the laser-etched features. Electroless plating methods that employ the laser-deposited Cu droplets as autocatalytic sites for plating (i.e., “seeds”) are then used to fill in the laser-etched features. Using this method, we have prepared functional printed circuit boards and transparent wire meshes on glass substrates.”

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Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology

Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology

[PRESS RELEASE] PORTLAND, Ore., Aug. 27, 2019 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a sale for the recently introduced ESI® CapStone™ printed circuit board (PCB) laser processing systems to Cicor.

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MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution

[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.

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Are Your Laser Capabilities Ready For 5g?

Are Your Laser Capabilities Ready For 5g?

Beyond the Photon - Dr. Zhang provides insights into the current challenges and new opportunities in PCB manufacturing. You will get an understanding of the latest applications and materials emerging to deliver the future of communication - the 5G revolution.

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Taking our Laser Show on the Road at CPCA 2019

Taking our Laser Show on the Road at CPCA 2019

Planning on attending CPCA 2019 at the Shanghai New International Expo Centre? Stop by our ESI exhibit, which is located within the WKK booth 7R16.

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ESI Receives Significant Asia Order

ESI Receives Significant Asia Order

“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”

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Can you engineer innovation to learn faster than your competitors?

Can you engineer innovation to learn faster than your competitors?

How are innovators building strategic frameworks to choose lasers and analyze materials? What equipment are innovators using to process new materials to stay one step ahead? Do new end market demands require the rethinking of laser systems and architectures?

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Sights from HKPCA 2018

Sights from HKPCA 2018

ESI's photon playground is laser-focused on showcasing world-class via drilling solutions. The power of the photon is on full display at ESI's booth during the 2018 HKPCA show.

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Introducing Geode

Introducing Geode

[official press relese] The new Geode CO2 laser drilling system for HDI rigid printed circuit board manufacturing combines dramatically increased throughput with the accuracy and flexibility required for advanced 5G applications ̶ all in a smaller, lighter package

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How Does Japanese Kiragami Inspire Flexible Circuit Design?

How Does Japanese Kiragami Inspire Flexible Circuit Design?

Technology News & Highlights Week of April 24, 2018 Discover 5 pieces of news on new technology that the ESI marketing team found especially interesting, exciting or just downright intriguing. [CONTENT WARNING] The following post was written by a marketeer and not one of our super smart laser scientist to proceed at your own risk. Long live lasers!

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For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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