[PRESS RELEASE] “CapStone has definitely been a game changer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “As Flex PCB manufacturers continue to upgrade their processing capabilities to address new technologies such as 5G, the CapStone system is enabling them to take advantage of latest-generation laser technology to stay current in a very competitive market.”
Intra-pulse beam steering for High-Density-Interconnect via drilling by Jan Kleinert - Research Director at ESI, a Division of MKS Inc.
[Press Release] According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko, “Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. Add to this the broad range of applications and materials that Geode can process, and the decision is clear.” READ FULL RELEASE
We got the opportunity to speak with a MKS Director of Product Marketing in the mighty photon podcast lab and asked him 3 big questions on 5G. He compares country roads with interstate freeways to explain the arrival of 5G and the new applications that will spring up along the I-5G corridor.
The 1,000th system rolled off the manufacturing line in Singapore in March and is destined for the Vietnam production facility of the Sonova Group, based in Stäfa, Switzerland. “This will be our fifth 5335 system,” said Stephan Kaderli, Director Operations SOCS at Sonova. “As a global company that relies on global support, it’s important that we have systems we can rely on. The 5335 has proven itself over the years, and we are happy to be adding this system to our existing set of 5335s.”
“Although a majority of the work we do for them involves high-volume through-via drilling, they also have the need for us to process flex PCB’s that require blind vias. That meant that we needed a solution we could rely on to do both. After evaluating the RedStone system...
Zhen Ding Technologies (ZDT), a manufacturer of high density interconnects (HDI) and flexible printed circuit boards (PCBs), awarded our E&S division the Strategic Cooperation Partner award, recognizing unique technology in the FPC manufacturing process
“A novel process for the preparation of conductive features on glass substrates is presented. In this process, an ultrafast green laser is utilized to remove material from a transparent glass substrate, and a second laser source deposits Cu droplets through the laser-induced forward transfer of a donor film into the laser-etched features. Electroless plating methods that employ the laser-deposited Cu droplets as autocatalytic sites for plating (i.e., “seeds”) are then used to fill in the laser-etched features. Using this method, we have prepared functional printed circuit boards and transparent wire meshes on glass substrates.”
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.