ESI’s New CapStone Flexible PCB Laser Processing Solution Delivers the Highest Via Drilling Throughput in the Industry
[Press Release] CapStone system features recent advances in laser technology and control to double throughput and reduce via drilling costs by 30 percent...
ESI’s New Allegro LC Extends High-Volume Test Capability to Larger MLCCsNew system from market leader addresses MLCC test demand for consumer and automotive markets PORTLAND, Ore., Oct. 01, 2018 (GLOBE NEWSWIRE)
Whether you already have experience with FPC laser processing or are just getting started, I think you will find the information in this eBook helpful. It ’s a “how-to” guide to understanding the options, trade-offs, challenges, and rewards of supplementing your flex circuit production capabilities with laser processing.
As you prepare to build a more precise, accurate and flexible production environment discover insights from Helen Li, lead optics engineer, on optical design considerations to keep you ahead of your competition and make your laser choices. Part of ESI’s Chalk Talk Video Series.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.